DESCRIPTION
- Designed to convert any digital integrated circuit in SOJ, TSOP, PLCC, and SOIC package to ZIP package
- Drop-in replacement for end-of-life ZIP ICs
- Eliminate the need to redesign costly motherboards
- Convenient platform for breadboard prototyping when only surface mount components are available
FEATURES
- Designed to accept SOICs in either narrow 0.150" or wide 0.300"
- Designed to accept SOJs in either 300 mil or 400 mil packages
- Multi-chip and double-sided configurations for special functions
- Accutek ZIPs include an on-board decoupling capacitor
SPECIAL CONFIGURATION
- Electronic and Mechanical CAD system to design any custom configuration
- Conversion of surface mount component to a ZIP package
- Pin correction to replace an obsolete device with newer device
- Multiple IC combination to emulate a single device function
CONTACT US FOR UNIQUE SOLUTIONS REQUIRING PRODUCTS FOR:
- Linear/Analog IC's
- Unique configurations for analog functions
- Any kind of semiconductor memory (SRAM, DRAM, FIFO, EEPROM, EPROM)
- PGA, PAL, GAL, FPGA, ETLC, TLL, and CMOS Logic Devices
- Multi-chip modules in any combination
- Pin-signal correction to allow substitution for non-pin compatible IC's
The Accutek product description and part numbers are listed below. Click on the part number to download the corresponding Data Sheet.
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